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Typical Electrical and Thermal Characteristics (continued)
40
32
24
V DS = -5.0V
T J = -55°C
25°C
2.5
2
1a
16
125°C
1.5
1b
1c
T A = 2 5 C
8
1
4.5"x5" FR-4 Board
o
Still Air
0
0
-4
-8
-12
-16
-20
0.5
0
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in )
I
D
, DRAIN CURRENT (A)
2
Figure 13. Transconductance Variation with Drain
Current and Temperature.
8
Figure 14. SO-8 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad Area.
50
10
1m us
ms
0m
7
1a
30
10
3
RD
S
(O
N)
LIM
IT
10
10
s
0
s
6
1
1s
0.3
10
DC
s
T A = 2 5 C
θ J A
5
4
0
1b
1c
4.5"x5" FR-4 Board
o
Still Air
V G S = - 4 . 5 V
0.2 0.4 0.6 0.8
2oz COPPER MOUNTING PAD AREA (in 2 )
1
0.1
0.03
0.01
0.1
R
V GS = -4.5V
SINGLE PULSE
= See Note 1c
T A = 25°C
0.2 0.5 1 2 5 10
- V DS , DRAIN-SOURCE VOLTAGE (V)
20
50
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
1
Figure 16. Maximum Safe Operating Area.
0 .5
D = 0.5
0 .2
0 .1
0 .0 5
0.2
0.1
0.05
R θ JA (t) = r(t) * R θ JA
R θ JA = See Note 1c
0 .0 2
0 .0 1
0 .0 0 5
0.02
0.01
Single Pulse
P(pk)
t 1
T J - T A
t 2
= P * R θ JA (t)
0 .0 0 2
Duty Cycle, D = t 1 / t 2
0 .0 0 1
0 .0001
0 .001
0 .0 1
0 .1
1
10
100
300
t 1 , TIME (sec)
Figure 17. Transient Thermal Response Curve .
Note:
Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8434 Rev. A3
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